| PART |
Description |
Maker |
| SDA-44472-1650 0444721650 |
4.20mm (.165) Pitch Mini-Fit HCS Header, Dual Row, Vertical
4.20mm (.165") Pitch Mini-Fit HCS垄芒 Header, Dual Row, Vertical
|
Molex Electronics Ltd.
|
| 0015910040 015-91-0040 713080104N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0554011019 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Vertical,Shrouded Header with Eject Levers, 10 Circuits, Lead-free
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0554014019 55401-4019 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Vertical,Shrouded Header with Eject Levers, 40 Circuits, Lead-free
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0353171020 35317-1020 |
4.20mm (.165") Pitch Mini-Fit庐 Header, Dual Row, Vertical, 10 Circuits, PA Polyamide
4.20mm (.165) Pitch Mini-Fit? Header, Dual Row, Vertical, 10 Circuits, PA Polyamide
|
Molex Electronics Ltd.
|
| 70280-0043 A-70280-0043 010-89-7062 0010897062 |
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature
|
Molex Electronics Ltd.
|
| 2MBHR-XX-VSG-SMT-P |
DUAL ROW VERTICAL MOUNT BOX HEADER
|
Adam Technologies, Inc.
|
| 15-80-0081 A-70567-0002 0015800081 705670002 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0121 A-70567-0004 0015800121 705670004 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0089 0015800089 A-70567-0274 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0143 0015800143 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
|
